Intel confirmed that future processor generations, including Panther Lake, Nova Lake, and successors, will not adopt the same MoP package-level memory integration as seen in Lunar Lake, as shared by CEO Pat Gelsinger during Intel’s Q3 2024 earnings call on November 1.
The Core Ultra 200V series, codenamed Lunar Lake, utilizes MoP (Memory-on-Package) technology to directly integrate 16GB or 32GB of LPDDR5x-8533 memory.
Gelsinger explained that Lunar Lake was initially designed as a niche product focused on high performance and extended battery life.
However, the popularity of AI-powered PCs boosted demand, and Lunar Lake shipments now constitute a “small but meaningful” segment of Intel’s portfolio.
Intel CFO David Zinsner highlighted an increased forecast for Lunar Lake shipments, expecting three times the previous estimate for next year.
Gelsinger clarified that the MoP memory approach in Lunar Lake was a “one-time” solution.
Future processors, such as Panther Lake and Nova Lake, will revert to traditional memory packaging, with memory housed externally rather than integrated within the package.
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