Samsung Electronics is reportedly testing TEL’s Acrevia GCB equipment to enhance the EUV lithography process.
On September 3, according to media The Elec, Samsung is currently testing the Acrevia GCB gas cluster beam system from Tokyo Electron (TEL).
The Acrevia GCB system, launched by TEL on July 8 this year, uses gas cluster beams to locally and precisely shape EUV lithography patterns, allowing it to repair defects and reduce pattern roughness.
Industry experts suggest that TEL’s Acrevia system could serve a function similar to the Centura Sculpta system from Applied Materials, shaping EUV exposure patterns directly and minimizing the need for multiple costly exposures.
This could shorten the lithography process and enhance overall profitability.
Additionally, the Acrevia system can address random errors, which constitute about half of EUV lithography defects, thus improving product yield.
TEL representatives confirmed that potential customers are actively testing the Acrevia system, with expectations that it will initially be deployed in logic sub-processing rather than memory fields.
Previously, Samsung Electronics tested the Centura Sculpta system from Applied Materials on its 4nm process. Now, by testing TEL’s equipment, Samsung aims to boost competition between the two major semiconductor equipment suppliers in pattern shaping.
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